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Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
Seung-Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu, Huang-Lin Chao, Paul Ho, Min Ding, Peng Su, Trent Uehling, Lakshmi N. Ramanathan
2006
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