State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

Li, Kongjing; Crichton, Stuart; Tian, Gui Yun; Cheng, Liang; Yin, Aijun; Cao, Wenping

doi:10.1109/TPEL.2013.2288334

Record: found
Abstract: not found
Article: not found

State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

Author(s): Kongjing Li , Gui Yun Tian , Liang Cheng , Aijun Yin , Wenping Cao , Stuart Crichton

Publication date (Print): September 2014

Journal: IEEE Transactions on Power Electronics

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

Read this article at

ScienceOpenPublisher

Bookmark

There is no author summary for this article yet. Authors can add summaries to their articles on ScienceOpen to make them more accessible to a non-specialist audience.

Related collections

Most cited references 46

Record: found
Abstract: not found
Article: not found

An Industry-Based Survey of Reliability in Power Electronic Converters

P. Tavner, Shaoyong Yang, Li Ran … (2011)

0 comments Cited 85 times – based on 0 reviews      Review now

Bookmark

Record: found
Abstract: not found
Article: not found

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Angus Bryant, Philip A. Mawby, Li Ran … (2010)

0 comments Cited 69 times – based on 0 reviews      Review now

Bookmark

Record: found
Abstract: not found
Article: not found

Surface Crack Detection for Carbon Fiber Reinforced Plastic (CFRP) Materials Using Pulsed Eddy Current Thermography

Liang Cheng, Gui Tian (2011)

0 comments Cited 37 times – based on 0 reviews      Review now

Bookmark

All references

Author and article information

Journal

Title: IEEE Transactions on Power Electronics

Abbreviated Title: IEEE Trans. Power Electron.

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

ISSN (Print): 0885-8993

ISSN (Electronic): 1941-0107

Publication date Created: September 2014

Publication date (Print): September 2014

Volume: 29

Issue: 9

Pages: 5000-5009

Article

DOI: 10.1109/TPEL.2013.2288334

SO-VID: f1a771b3-56b4-4cfc-9d77-6f677d962db6

History

Data availability:

State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

Read this article at

Related collections

Genome Engineering using CRISPR

Most cited references 46

An Industry-Based Survey of Reliability in Power Electronic Converters

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Surface Crack Detection for Carbon Fiber Reinforced Plastic (CFRP) Materials Using Pulsed Eddy Current Thermography

Author and article information

Journal

Article

History

Comments

Comment on this article

Similar content 1,646

Cited by 11

Most referenced authors 401