Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

Jang, Jin-Wook; De Silva, Ananda P.; Drye, James E.; Post, Steve L.; Owens, Norman L; Lin, Jong-Kai; Frear, Darrel R.

doi:10.1109/TEPM.2006.890643

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Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

Author(s): Jin-Wook Jang , Ananda P. De Silva , James E. Drye , Steve L. Post , Norman L. Owens , Jong-Kai Lin , Darrel R. Frear

Publication date (Print): January 2007

Journal: IEEE Transactions on Electronics Packaging Manufacturing

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

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Title: IEEE Transactions on Electronics Packaging Manufacturing

Abbreviated Title: IEEE Trans. Electron. Packag. Manufact.

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

ISSN (Print): 1521-334X

Publication date Created: January 2007

Publication date (Print): January 2007

Volume: 30

Issue: 1

Pages: 49-53

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DOI: 10.1109/TEPM.2006.890643

SO-VID: f1e350a5-c2b0-4794-a0b5-ee4cf2b202f2

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Self URI (article page): http://ieeexplore.ieee.org/document/4118349/

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Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

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