Blog
About

4,328
views
2
recommends
+1 Recommend
1 collections
    78
    shares
      • Record: found
      • Abstract: found
      • Article: found
      Is Open Access

      Marrying medicine and materials: artemisinin (Qinghaosu) particle is soft enough for scratching hard SiC wafer in water

      Read this article at

      Bookmark
          There is no author summary for this article yet. Authors can add summaries to their articles on ScienceOpen to make them more accessible to a non-specialist audience.

          Abstract

          Silicon carbide (SiC) single crystals, along with sapphire and silicon, are one of the most important substrates for high-brightness light-emitting diode fabrications. Owing to extremely high hardness (Mohs’ scale of 9.5) and chemical inertness, the polishing rate of SiC with conventional chemical mechanical polishing methods is not high, and surface scratches are also inevitable because of using slurry containing hard abrasives such as silica particles. Here artemisinin (Qinghaosu) crystals, very soft molecular solids, were found, for the first time to the best of our knowledge, to effectively polish SiC wafers even in pure water as demonstrated by proof-of-concept scratching experiments using atomic force microscopy. The underlying mechanism is attributed to activated oxidation of SiC by mechanically released reactive · OH free radicals from the endoperoxide bridges. The preliminary results reported here have important implications for developing novel alternative green and scratch-free polishing methods for hard-brittle substrates including SiC, diamond, and others.

          Related collections

          Most cited references 25

          • Record: found
          • Abstract: not found
          • Article: not found

          Hybrid polishing mechanism of single crystal SiC using mixed abrasive slurry (MAS)

           H.S. Lee,  D.I. Kim,  J.H. An (2010)
            Bookmark
            • Record: found
            • Abstract: not found
            • Article: not found

            Colloidal drug probe: Method development and validation for adhesion force measurement using Atomic Force Microscopy

              Bookmark
              • Record: found
              • Abstract: not found
              • Article: not found

              Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

               G PAN,  Y. ZHOU,  G Luo (2013)
                Bookmark

                Author and article information

                Contributors
                Journal
                SOR-MATSCI
                ScienceOpen Research
                ScienceOpen
                2199-1006
                27 January 2016
                : 0 (ID: 0d3cb971-575c-4a49-9022-bb549b69f9b5 )
                : 0
                : 1-7
                Affiliations
                [1 ]School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 150001, China
                [2 ]School of Mechanical Engineering, Harbin Institute of Technology, Harbin 150001, China
                Author notes
                [* ]Corresponding author’s e-mail address: ygan@ 123456hit.edu.cn
                Article
                3528:XE
                10.14293/S2199-1006.1.SOR-MATSCI.AMNMZS.v1
                © 2016 Zhu et al.

                This work has been published open access under Creative Commons Attribution License CC BY 4.0 , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Conditions, terms of use and publishing policy can be found at www.scienceopen.com .

                Page count
                Figures: 3, Tables: 0, References: 27, Pages: 7
                Product
                Categories
                Original article

                Comments

                Comment on this article