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87
Diffusion soldering for stable high-temperature thin-film bonds
Authors:
Thomas Studnitzky
,
Rainer Schmid-Fetzer
Thermodynamic assessment of the Al–Cu–Zn system, part I: Cu–Zn binary system
Authors:
Song-Mao Liang
,
Hsien-Ming Hsiao
,
Rainer Schmid-Fetzer
Metals on 6H-SiC: contact formation from the materials science point of view
Authors:
Fred Goesmann
,
Rainer Schmid-Fetzer
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Rainer Schmid-Fetzer
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