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      A review of mechanical properties of lead-free solders for electronic packaging

      Author(s): ,
      Publication date (Electronic):
      Journal: Journal of Materials Science
      Publisher: Springer Nature

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          A first report on deformation-mechanism maps

          M.F. Ashby (1972)
          Article 0 comments Cited 103 times – based on 0 reviews     Review now
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            Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

            K.S. Kim, S.H. Huh, K Suganuma (2002)
            Article 0 comments Cited 19 times – based on 0 reviews     Review now
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              Constitutive relations for tin-based solder joints

              K. Banerji, R. Darveaux (1992)
              Article 0 comments Cited 14 times – based on 0 reviews     Review now
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                Author and article information

                Journal
                Title: Journal of Materials Science
                Abbreviated Title: J Mater Sci
                Publisher: Springer Nature
                ISSN (Print): 0022-2461
                ISSN (Electronic): 1573-4803
                Publication date Created: March 2009
                Publication date (Electronic): January 27 2009
                Publication date (Print): March 2009
                Volume: 44
                Issue: 5
                Pages: 1141-1158
                Article
                DOI: 10.1007/s10853-008-3125-9
                SO-VID: 0e7eaa58-0a1f-404d-9592-9ff71abdf67e
                Copyright © © 2009
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