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Electrical properties of superfilled sub-micrometer silver metallizations
D. Josell ,
C. Burkhard ,
Y. Li ,
Y.-W. Cheng ,
R. R. Keller ,
C. A. Witt ,
D. R. Kelley ,
J. E. Bonevich ,
B. C. Baker ,
T. P. Moffat
July 2004
July 2004
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