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      Memory materials and devices: From concept to application

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          Symmetric Ultrafast Writing and Erasing Speeds in Quasi-Nonvolatile Memory via van der Waals Heterostructures.

          Due to the large gap in timescale between volatile memory and nonvolatile memory technologies, quasi-nonvolatile memory based on 2D materials has become a viable technology for filling the gap. By exploiting the elaborate energy band structure of 2D materials, a quasi-nonvolatile memory with symmetric ultrafast write-1 and erase-0 speeds and long refresh time is reported. Featuring the 2D semifloating gate architecture, an extrinsic p-n junction is used to charge or discharge the floating gate. Owing to the direct injection or recombination of charges from the floating gate electrode, the erasing speed is greatly enhanced to nanosecond timescale. Combined with the ultrafast write-1 speed, symmetric ultrafast operations on the nanosecond timescale are achieved, which are ≈106 times faster than other memories based on 2D materials. In addition, the refresh time after a write-1 operation is 219 times longer than that of dynamic random access memory. This performance suggests that quasi-nonvolatile memory has great potential to decrease power consumption originating from frequent refresh operations, and usher in the next generation of high-speed and low-power memory technology.
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            13.3 A 7Mb STT‐MRAM in 22FFL FinFET technology with 4ns read sensing time at 0.9 V using write‐verify‐write scheme and offset‐cancellation sensing technique

            Wei L. (2019)
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              Author and article information

              Contributors
              Journal
              InfoMat
              InfoMat
              Wiley
              2567-3165
              2567-3165
              March 2020
              January 19 2020
              March 2020
              : 2
              : 2
              : 261-290
              Affiliations
              [1 ]State Key Laboratory of ASIC and System, School of Microelectronics Fudan University Shanghai China
              [2 ]Key Laboratory of Microelectronic Devices and Circuits (MOE), Institute of Microelectronics Peking University Beijing China
              [3 ]Key Laboratory of Microelectronic Devices and Integrated Technology, Institute of Microelectronics Chinese Academy of Sciences Beijing China
              [4 ]College of Materials Science and Engineering Shenzhen University Shenzhen China
              [5 ]Institute of Microelectronics Tsinghua University Beijing China
              Article
              10.1002/inf2.12077
              353b8a0d-197e-4626-bb4b-f2e2e5883b10
              © 2020

              http://creativecommons.org/licenses/by/4.0/

              http://doi.wiley.com/10.1002/tdm_license_1.1

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