Thermal expansion of reference materials: copper, silica and silicon

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Journal

Title: Journal of Physics D: Applied Physics

Abbreviated Title: J. Phys. D: Appl. Phys.

Publisher: IOP Publishing

ISSN (Print): 00223727

Publication date (Print): November 1973

Volume: 6

Issue: 17

Pages: 2070-2078

Article

DOI: 10.1088/0022-3727/6/17/313

SO-VID: 4013bc3e-99c1-4075-b5a5-aa0e2d13667a

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