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Thin Films Prepared by Atomic Layer Deposition as Diffusion Barriers for Cu Metallization
Author(s):
Tae Hong
,
Tae-Ho Kim
,
Jae-Hun Jung
,
Soo-Hyun KIM
,
Hoon Kim
Publication date:
2014
Journal:
Journal of the American Ceramic Society
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JAMA Network: Coronavirus
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DOI::
10.1111/jace.12695
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