Epoxy thermoset resins with high pristine thermal conductivity

Abstract

Heat dissipation becomes a critical problem because of the miniaturisation and the increase of power density in electronic devices and electric equipment, which calls for electrical insulating materials with high thermal management capability. Epoxy thermosets have been widely used as electrical insulating materials, but suffer from their low thermal conductivity. This study reviewed the research progress on the development of epoxy thermosets with high pristine thermal conductivity. First, the thermal conduction mechanism of polymers was briefly introduced. Second, the approaches used to enhance the thermal conductivity of epoxy thermosets were summarised, which mainly dealt with the formation of microscopically anisotropic but macroscopically isotropic structure in the epoxy thermosets. Third, the applications of high thermal conductivity epoxy thermoset resins were reviewed. Finally, the review provided the existing challenges and the future directions for the development of epoxy thermosets with high pristine thermal conductivity.

Contributors

Xingyi Huang

Journal

Journal ID (publisher-id): HVE

Title: High Voltage

Abbreviated Title: High Volt.

Publisher: The Institution of Engineering and Technology

ISSN (Print): 2397-7264

ISSN (Electronic):

Publication date (Electronic preprint): 4 August 2017

Publication date (Electronic): 25 September 2017

Publication date (Print): September 2017

Volume: 2

Issue: 3

Pages: 139-146

Affiliations

Shanghai Key Laboratory of Electrical Insulation and Thermal Ageing, Shanghai Jiao Tong University , Shanghai 200240, People's Republic of China

Article

Publisher ID: HVE.2017.0120 Manuscript ID: HVE.2017.0120

DOI: 10.1049/hve.2017.0120

License:

This is an open access article published by the IET and CEPRI under the Creative Commons Attribution License ( http://creativecommons.org/licenses/by/3.0/)

Page count

Pages: 0

Product

Self URI (journal page): https://digital-library.theiet.org/content/journals/

Funding

Funded by: Special Fund of the National Priority Basic Research of China

Award ID: 2014CB239503

Funded by: National Natural Science Foundation of China

Award ID: 51522703

Award ID: 51477096

Categories

Subject: Special Issue: Thermally Conductive but Electrically Insulating Materials For High Voltage Applications