25 September 2017
epoxy insulation, thermal conductivity, macroscopically isotropic structure formation, microscopically anisotropic structure formation, polymer thermal conduction mechanism, thermal conductivity, epoxy thermoset resins
Heat dissipation becomes a critical problem because of the miniaturisation and the increase of power density in electronic devices and electric equipment, which calls for electrical insulating materials with high thermal management capability. Epoxy thermosets have been widely used as electrical insulating materials, but suffer from their low thermal conductivity. This study reviewed the research progress on the development of epoxy thermosets with high pristine thermal conductivity. First, the thermal conduction mechanism of polymers was briefly introduced. Second, the approaches used to enhance the thermal conductivity of epoxy thermosets were summarised, which mainly dealt with the formation of microscopically anisotropic but macroscopically isotropic structure in the epoxy thermosets. Third, the applications of high thermal conductivity epoxy thermoset resins were reviewed. Finally, the review provided the existing challenges and the future directions for the development of epoxy thermosets with high pristine thermal conductivity.