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      Epoxy thermoset resins with high pristine thermal conductivity

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          Abstract

          Heat dissipation becomes a critical problem because of the miniaturisation and the increase of power density in electronic devices and electric equipment, which calls for electrical insulating materials with high thermal management capability. Epoxy thermosets have been widely used as electrical insulating materials, but suffer from their low thermal conductivity. This study reviewed the research progress on the development of epoxy thermosets with high pristine thermal conductivity. First, the thermal conduction mechanism of polymers was briefly introduced. Second, the approaches used to enhance the thermal conductivity of epoxy thermosets were summarised, which mainly dealt with the formation of microscopically anisotropic but macroscopically isotropic structure in the epoxy thermosets. Third, the applications of high thermal conductivity epoxy thermoset resins were reviewed. Finally, the review provided the existing challenges and the future directions for the development of epoxy thermosets with high pristine thermal conductivity.

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          Most cited references 43

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          Thermal conductivity of carbon nanotubes and their polymer nanocomposites: A review

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            Emerging challenges and materials for thermal management of electronics

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              Thermal conductivity of polymer-based composites: Fundamentals and applications

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                Author and article information

                Contributors
                Journal
                HVE
                High Voltage
                High Volt.
                The Institution of Engineering and Technology
                2397-7264
                4 August 2017
                25 September 2017
                September 2017
                : 2
                : 3
                : 139-146
                Affiliations
                Shanghai Key Laboratory of Electrical Insulation and Thermal Ageing, Shanghai Jiao Tong University , Shanghai 200240, People's Republic of China
                Article
                HVE.2017.0120 HVE.2017.0120
                10.1049/hve.2017.0120

                This is an open access article published by the IET and CEPRI under the Creative Commons Attribution License ( http://creativecommons.org/licenses/by/3.0/)

                Page count
                Pages: 0
                Product
                Funding
                Funded by: Special Fund of the National Priority Basic Research of China
                Award ID: 2014CB239503
                Funded by: National Natural Science Foundation of China
                Award ID: 51522703
                Award ID: 51477096
                Categories
                Special Issue: Thermally Conductive but Electrically Insulating Materials For High Voltage Applications

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