Single-phase liquid cooled microchannel heat sink for electronic packages

Zhang, H.Y.; Pinjala, D.; Wong, T.N.; Toh, K.C.; Joshi, Y.K.

doi:10.1016/j.applthermaleng.2004.09.014

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Single-phase liquid cooled microchannel heat sink for electronic packages

Author(s): H.Y. Zhang , D. Pinjala , T.N. Wong , K.C. Toh , Y.K. Joshi

Publication date Created: July 2005

Publication date (Print): July 2005

Journal: Applied Thermal Engineering

Publisher: Elsevier BV

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Title: Applied Thermal Engineering

Abbreviated Title: Applied Thermal Engineering

Publisher: Elsevier BV

ISSN (Print): 13594311

Publication date Created: July 2005

Publication date (Print): July 2005

Volume: 25

Issue: 10

Pages: 1472-1487

Article

DOI: 10.1016/j.applthermaleng.2004.09.014

SO-VID: a1fba5dc-55f0-49d9-9610-f521014215bc

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http://www.elsevier.com/tdm/userlicense/1.0/

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Single-phase liquid cooled microchannel heat sink for electronic packages

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