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Single-phase liquid cooled microchannel heat sink for electronic packages
Author(s):
H.Y. Zhang
,
D. Pinjala
,
T.N. Wong
,
K.C. Toh
,
Y.K. Joshi
Publication date
Created:
July 2005
Publication date
(Print):
July 2005
Journal:
Applied Thermal Engineering
Publisher:
Elsevier BV
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There is no author summary for this article yet. Authors can add summaries to their articles on ScienceOpen to make them more accessible to a non-specialist audience.
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Electronic Workshops in Computing (eWiC)
Author and article information
Journal
Title:
Applied Thermal Engineering
Abbreviated Title:
Applied Thermal Engineering
Publisher:
Elsevier BV
ISSN (Print):
13594311
Publication date Created:
July 2005
Publication date (Print):
July 2005
Volume
: 25
Issue
: 10
Pages
: 1472-1487
Article
DOI:
10.1016/j.applthermaleng.2004.09.014
SO-VID:
a1fba5dc-55f0-49d9-9610-f521014215bc
Copyright ©
© 2005
License:
http://www.elsevier.com/tdm/userlicense/1.0/
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