3
views
0
recommends
+1 Recommend
0 collections
    0
    shares
      • Record: found
      • Abstract: not found
      • Article: not found

      Single-phase liquid cooled microchannel heat sink for electronic packages

      , , , ,
      Applied Thermal Engineering
      Elsevier BV

      Read this article at

      ScienceOpenPublisher
      Bookmark
          There is no author summary for this article yet. Authors can add summaries to their articles on ScienceOpen to make them more accessible to a non-specialist audience.

          Related collections

          Author and article information

          Journal
          Applied Thermal Engineering
          Applied Thermal Engineering
          Elsevier BV
          13594311
          July 2005
          July 2005
          : 25
          : 10
          : 1472-1487
          Article
          10.1016/j.applthermaleng.2004.09.014
          a1fba5dc-55f0-49d9-9610-f521014215bc
          © 2005

          http://www.elsevier.com/tdm/userlicense/1.0/

          History

          Comments

          Comment on this article