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1,369
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Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration
Author(s):
Johann Knechtel
1
,
Ozgur Sinanoglu
1
,
Ibrahim (Abe) M. Elfadel
2
,
Jens Lienig
3
,
Cliff C. N. Sze
4
Publication date
Created:
2017
Publication date
(Print):
2017
Journal:
IPSJ Transactions on System LSI Design Methodology
Publisher:
Information Processing Society of Japan
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134
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Review of Silicon Photonics Foundry Efforts
QING FANG
,
Chao Li
,
Xiaoguang Tu
…
(2014)
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3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration
K. Banerjee
,
S.J. Souri
,
P. Kapur
…
(2001)
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MEMS inertial sensors: A tutorial overview
Derek K. Shaeffer
(2013)
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Author and article information
Journal
Title:
IPSJ Transactions on System LSI Design Methodology
Abbreviated Title:
IPSJ Transactions on System LSI Design Methodology
Publisher:
Information Processing Society of Japan
ISSN (Electronic):
1882-6687
Publication date Created:
2017
Publication date (Print):
2017
Volume
: 10
Issue
: 0
Pages
: 45-62
Affiliations
[
1
]
New York University Abu Dhabi
[
2
]
Masdar Institute, Khalifa University of Science and Technology
[
3
]
TU Dresden
[
4
]
Google Inc.
Article
DOI:
10.2197/ipsjtsldm.10.45
SO-VID:
b29e0583-6f57-4090-8d92-2fa2abcce605
Copyright ©
© 2017
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