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      Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration

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          Review of Silicon Photonics Foundry Efforts

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            3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

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              MEMS inertial sensors: A tutorial overview

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                Author and article information

                Journal
                IPSJ Transactions on System LSI Design Methodology
                IPSJ Transactions on System LSI Design Methodology
                Information Processing Society of Japan
                1882-6687
                2017
                2017
                : 10
                : 0
                : 45-62
                Affiliations
                [1 ]New York University Abu Dhabi
                [2 ]Masdar Institute, Khalifa University of Science and Technology
                [3 ]TU Dresden
                [4 ]Google Inc.
                Article
                10.2197/ipsjtsldm.10.45
                b29e0583-6f57-4090-8d92-2fa2abcce605
                © 2017
                History

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