Mechanical characterization of sub-100-nm-thick Au thin films by electrostatically actuated tensile testing with several strain rates

Oh, Hyun Jin; Kawase, Shinya; Hanasaki, Itsuo; Isono, Yoshitada

doi:10.7567/JJAP.53.027201

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Mechanical characterization of sub-100-nm-thick Au thin films by electrostatically actuated tensile testing with several strain rates

Author(s): Hyun-Jin Oh , Shinya Kawase , Itsuo Hanasaki , Yoshitada Isono

Publication date Created: February 01 2014

Publication date (Print): February 01 2014

Journal: Japanese Journal of Applied Physics

Publisher: Japan Society of Applied Physics

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Title: Japanese Journal of Applied Physics

Abbreviated Title: Jpn. J. Appl. Phys.

Publisher: Japan Society of Applied Physics

ISSN (Print): 0021-4922

ISSN (Electronic): 1347-4065

Publication date Created: February 01 2014

Publication date (Print): February 01 2014

Volume: 53

Issue: 2

Page: 027201

Article

DOI: 10.7567/JJAP.53.027201

SO-VID: df6711db-e7d3-448f-ab5f-8ccd612ec754

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Mechanical characterization of sub-100-nm-thick Au thin films by electrostatically actuated tensile testing with several strain rates

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HR-EBSD (High Resolution - Electron Back Scatter Diffraction)

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