New aspects of simulation in hot embossing

Worgull, M.; Heckele, M.

doi:10.1007/s00542-004-0418-z

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New aspects of simulation in hot embossing

Author(s): M. Worgull , M. Heckele

Publication date Created: August 2004

Publication date (Print): August 2004

Journal: Microsystem Technologies

Publisher: Springer Nature America, Inc

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Title: Microsystem Technologies

Abbreviated Title: Microsystem Technologies

Publisher: Springer Nature America, Inc

ISSN (Print): 0946-7076

ISSN (Electronic): 1432-1858

Publication date Created: August 2004

Publication date (Print): August 2004

Volume: 10

Issue: 5

Pages: 432-437

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DOI: 10.1007/s00542-004-0418-z

SO-VID: f0f99a38-114e-4e44-ba3c-02a0d88b3dd3

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New aspects of simulation in hot embossing

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