Average rating: | Rated 4.5 of 5. |
Level of importance: | Rated 5 of 5. |
Level of validity: | Rated 4 of 5. |
Level of completeness: | Rated 4 of 5. |
Level of comprehensibility: | Rated 5 of 5. |
Competing interests: | None |
This manuscript describes an interesting method for effectively polishing SiC wafers using antimalarial drug artemisinin. The polishing mechanism discussed in this proof-of-concept demonstration would have important implications for developing novel polishing methods. Overall this work is logically pursued and the manuscript is well written. However, I have some concerns regarding the research work as listed below:
1. The equation in Figure 3: 2SiC + 4OH·+3O2 → 2SiC32– +4H+ + 2CO2 should be corrected to
2SiC + 4OH·+3O2 → 2SiO32– +4H+ + 2CO2.
2. Figure 2c should be marked in Text in Page 3 for clarity.
3. In paragraph 1 Page 4, the authors should provide some references to explain the relationship between melting point and hardness, before concluded that artemisinin crystals have lower hardness compared with other common abrasives.