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      A plasticity-based model of material removal in chemical-mechanical polishing (CMP)

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          Chemical processes in glass polishing

          Lee Cook (1990)
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            Material removal mechanism in chemical mechanical polishing: theory and modeling

            D.A. Dornfeld, Jianfeng Luo (2001)
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              Chemical Mechanical Planarization of Microelectronic Materials

              Joseph Steigerwald, Shyam Murarka, Ronald Gutmann (1997)
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                Author and article information

                Journal
                Title: IEEE Transactions on Semiconductor Manufacturing
                Abbreviated Title: IEEE Trans. Semicond. Manufact.
                Publisher: Institute of Electrical and Electronics Engineers (IEEE)
                ISSN (Print): 08946507
                Publication date (Print): Nov. 2001
                Volume: 14
                Issue: 4
                Pages: 406-417
                Article
                DOI: 10.1109/66.964328
                SO-VID: 13ed1738-fedb-4076-b065-cfe1d7f012bc
                Copyright © © 2001
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