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      Three-Dimensional Printed Electrode and Its Novel Applications in Electronic Devices

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          Abstract

          Three-dimensional (3D) printing technology provides a novel approach to material fabrication for various applications because of its ability to create low-cost 3D printed platforms. In this study, a printable graphene-based conductive filament was employed to create a range of 3D printed electrodes (3DEs) using a commercial 3D printer. This printing technology provides a simplistic and low-cost approach, which eliminates the need for the ex-situ modification and post-treatment of the product. The conductive nature of the 3DEs provides numerous deposition platforms for electrochemical active nanomaterials such as graphene, polypyrrole, and cadmium sulfide, either through electrochemical or physical approaches. To provide proof-of-concept, these 3DEs were physiochemically and electrochemically evaluated and proficiently fabricated into a supercapacitor and photoelectrochemical sensor. The as-fabricated supercapacitor provided a good capacitance performance, with a specific capacitance of 98.37 Fg −1. In addition, these 3DEs were fabricated into a photoelectrochemical sensing platform. They had a photocurrent response that exceeded expectations (~724.1 μA) and a lower detection limit (0.05 μM) than an ITO/FTO glass electrode. By subsequently modifying the printing material and electrode architecture, this 3D printing approach could provide a facile and rapid manufacturing process for energy devices based on the conceptual design.

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          Most cited references33

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          Electronics based on two-dimensional materials.

          The compelling demand for higher performance and lower power consumption in electronic systems is the main driving force of the electronics industry's quest for devices and/or architectures based on new materials. Here, we provide a review of electronic devices based on two-dimensional materials, outlining their potential as a technological option beyond scaled complementary metal-oxide-semiconductor switches. We focus on the performance limits and advantages of these materials and associated technologies, when exploited for both digital and analog applications, focusing on the main figures of merit needed to meet industry requirements. We also discuss the use of two-dimensional materials as an enabling factor for flexible electronics and provide our perspectives on future developments.
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            Direct Ink Writing of 3D Functional Materials

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              3D printed microfluidic devices: enablers and barriers.

              3D printing has the potential to significantly change the field of microfluidics. The ability to fabricate a complete microfluidic device in a single step from a computer model has obvious attractions, but it is the ability to create truly three dimensional structures that will provide new microfluidic capability that is challenging, if not impossible to make with existing approaches. This critical review covers the current state of 3D printing for microfluidics, focusing on the four most frequently used printing approaches: inkjet (i3DP), stereolithography (SLA), two photon polymerisation (2PP) and extrusion printing (focusing on fused deposition modeling). It discusses current achievements and limitations, and opportunities for advancement to reach 3D printing's full potential.
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                Author and article information

                Contributors
                janetlimhn@gmail.com
                huangnayming@xmu.edu.my
                Journal
                Sci Rep
                Sci Rep
                Scientific Reports
                Nature Publishing Group UK (London )
                2045-2322
                9 May 2018
                9 May 2018
                2018
                : 8
                : 7399
                Affiliations
                [1 ]ISNI 0000 0001 2231 800X, GRID grid.11142.37, Department of Chemistry, Faculty of Science, , Universiti Putra Malaysia, ; 43400 UPM Serdang, Selangor Darul Ehsan Malaysia
                [2 ]ISNI 0000 0001 2231 800X, GRID grid.11142.37, Materials Synthesis and Characterization Laboratory, Institute of Advanced Technology, , Universiti Putra Malaysia, ; 43400 UPM Serdang, Selangor Darul Ehsan Malaysia
                [3 ]ISNI 0000 0001 2231 800X, GRID grid.11142.37, Wireless and Photonics Network Research Centre, Faculty of Engineering, , Universiti Putra Malaysia, ; 43400 UPM Serdang, Selangor Darul Ehsan Malaysia
                [4 ]New Energy Science & Engineering Programme, University of Xiamen Malaysia, Jalan SunSuria, Bandar SunSuria, 43900 Sepang, Selangor Darul Ehsan Malaysia
                Author information
                http://orcid.org/0000-0003-2436-8953
                http://orcid.org/0000-0002-2843-181X
                Article
                25861
                10.1038/s41598-018-25861-3
                5943534
                29743664
                4a128d24-6122-43b7-ae59-498625593102
                © The Author(s) 2018

                Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

                History
                : 2 November 2017
                : 1 May 2018
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