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Bonding of InP laser diodes by Au-Sn solder and tungsten-based barrier metallization schemes
Author(s):
C. LEE
,
K Tai
,
D Bacon
,
C. Doherty
,
A. Katz
,
Y WONG
,
E. LANE
Publication date:
1994
Journal:
Semiconductor Science and Technology
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Recursive Rule based Visual Categorization
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DOI::
10.1088/0268-1242/9/4/008
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