Shape Optimization of Micro-Channel Heat Sink for Micro-Electronic Cooling

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Journal

Title: IEEE Transactions on Components and Packaging Technologies

Abbreviated Title: IEEE Trans. Comp. Packag. Technol.

Publisher: Institute of Electrical and Electronics Engineers (IEEE)

ISSN (Print): 1521-3331

ISSN (Electronic): 1557-9972

Publication date Created: June 2008

Publication date (Print): June 2008

Volume: 31

Issue: 2

Pages: 322-330

Article

DOI: 10.1109/TCAPT.2008.916791

SO-VID: 9b6b59a3-69cd-4abd-99ef-3f675b7d9594

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