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      Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions

      Author(s): , ,
      Publication date Created:
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      Journal: Journal of Electronic Materials
      Publisher: Springer Nature

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          Reaction-Diffusion in the Cu–Sn System

          Hideo Fujibuchi, Masami Onishi (1975)
          Article 0 comments Cited 30 times – based on 0 reviews     Review now
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            Diffusion and electromigration of silver and nickel in lead-tin alloys

            H. B. Huntington, C. Hu (1982)
            Article 0 comments Cited 16 times – based on 0 reviews     Review now
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              Analysis of low-temperature intermetallic growth in copper-tin diffusion couples

              J W Morris, A. Sunwoo, Z Mei (1992)
              Article 0 comments Cited 15 times – based on 0 reviews     Review now
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                Author and article information

                Journal
                Title: Journal of Electronic Materials
                Abbreviated Title: Journal of Elec Materi
                Publisher: Springer Nature
                ISSN (Print): 0361-5235
                ISSN (Electronic): 1543-186X
                Publication date Created: November 1998
                Publication date (Print): November 1998
                Volume: 27
                Issue: 11
                Pages: 1193-1199
                Article
                DOI: 10.1007/s11664-998-0068-5
                SO-VID: c79dbd38-4ec6-4abd-9027-1b53f0589cac
                Copyright © © 1998
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