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      LED array modules by new technology microbump bonding method

      Publication date Created:
      Publication date (Print):
      Journal: Microelectronics Reliability
      Publisher: Elsevier BV

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          Journal
          Title: Microelectronics Reliability
          Abbreviated Title: Microelectronics Reliability
          Publisher: Elsevier BV
          ISSN (Print): 00262714
          Publication date Created: January 1992
          Publication date (Print): January 1992
          Volume: 32
          Issue: 1-2
          Page: 294
          Article
          DOI: 10.1016/0026-2714(92)90198-T
          SO-VID: cb9f2f1c-e4db-48de-ae92-5a3f6db26671
          Copyright © © 1992
          License:

          https://www.elsevier.com/tdm/userlicense/1.0/

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