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3,695
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Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis
Author(s):
P. Vianco
,
J. Rejent
,
P.T. Vianco
,
J.A. Rejent
,
P. Vianco
,
J. Rejent
Publication date:
1999
Journal:
Journal of Electronic Materials
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Software for SAXS correction and analysis
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DOI::
10.1007/s11664-999-0250-4
ScienceOpen disciplines:
Materials technology
,
Materials characterization
,
Materials science
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ScienceOpen disciplines:
Materials technology
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Materials characterization
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Materials science
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