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      Void formation in Nb3Sn‐Cu superconducting wire produced by the external tin process

      Author(s): , , ,
      Publication date Created:
      Publication date (Print):
      Journal: Journal of Applied Physics
      Publisher: AIP Publishing

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          Motion of Inclusion Induced by a Direct Current and a Temperature Gradient

          Paul Ho (1970)
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            Growth of voids in metals during diffusion and creep

            R.W Balluffi, L.L Seigle (1957)
            Article 0 comments Cited 16 times – based on 0 reviews     Review now
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              Effects associated with the Flow of Vacancies in Intermetallic Diffusion

              R. S. Barnes (1952)
              Article 0 comments Cited 12 times – based on 0 reviews     Review now
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                Author and article information

                Journal
                Title: Journal of Applied Physics
                Abbreviated Title: Journal of Applied Physics
                Publisher: AIP Publishing
                ISSN (Print): 0021-8979
                ISSN (Electronic): 1089-7550
                Publication date Created: March 15 1986
                Publication date (Print): March 15 1986
                Volume: 59
                Issue: 6
                Pages: 2105-2113
                Article
                DOI: 10.1063/1.336399
                SO-VID: e244c394-168a-44bb-9d08-84622fe7947d
                Copyright © © 1986
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