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      • Record: found
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      The potential and challenges of inferring thermal comfort at home using commodity sensors

      proceedings-article
      Author(s): 1 , 1 , 1
      Publication date (Print):
      Publication date (Print):
      Conference name: the 2015 ACM International Joint Conference (UbiComp '15)
      Conference date: October 07, 2015 - October 11, 2015

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          Author and article information

          Conference
          Publication date (Print): 2015
          Publication date (Print): 2015
          Pages: 1089-1100
          Affiliations
          [1 ]University of Michigan, Ann Arbor, Michigan
          Article
          DOI: 10.1145/2750858.2805831
          SO-VID: e43fe21d-e6ac-4c03-b26b-501a1298e40f
          Copyright © © 2015
          License:

          http://www.acm.org/publications/policies/copyright_policy#Background

          Conference name: the 2015 ACM International Joint Conference
          Conference acronym: UbiComp '15
          Conference number: 2015
          Conference location: Osaka, Japan
          Conference date: October 07, 2015 - October 11, 2015
          Conference sponsor: ACM, Association for Computing Machinery
          Conference sponsor: Bell Labs, Bell Laboratories
          Conference sponsor: Yahoo! Japan
          Conference sponsor: KDDI
          Conference sponsor: Telefónica
          Conference sponsor: Google Inc.
          Conference sponsor: ISTC-PC, Intel Science and Technology Center for Pervasive Computing
          Conference sponsor: SIGCHI, ACM Special Interest Group on Computer-Human Interaction
          Conference sponsor: SIGMOBILE, ACM Special Interest Group on Mobility of Systems, Users, Data and Computing
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