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      Dependence of Electromigration‐Induced Failure Time on Length and Width of Aluminum Thin‐Film Conductors

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      Journal of Applied Physics
      AIP Publishing

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          Current-induced marker motion in gold wires

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            RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMS

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              Electromigration in Thin Al Films

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                Author and article information

                Journal
                Journal of Applied Physics
                Journal of Applied Physics
                AIP Publishing
                0021-8979
                1089-7550
                September 1970
                September 1970
                : 41
                : 10
                : 3954-3960
                Article
                10.1063/1.1658395
                e92483fd-3361-49ca-90f4-318229eab9c2
                © 1970
                History

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