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      Accurate modelling of 3D-trench silicon sensor with enhanced timing performance and comparison with test beam measurements

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          Abstract

          This paper presents the detailed simulation of a double-pixel structure for charged particle detection based on the 3D-trench silicon sensor developed for the TIMESPOT project and a comparison of the simulation results with measurements performed at \(\pi-\)M1 beam at PSI laboratory. The simulation is based on the combined use of several software tools (TCAD, GEANT4, TCoDe and TFBoost) which allow to fully design and simulate the device physics response in very short computational time, O(1-100 s) per simulated signal, by exploiting parallel computation using single or multi-thread processors. This allowed to produce large samples of simulated signals, perform detailed studies of the sensor characteristics and make precise comparisons with experimental results.

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          Author and article information

          Journal
          15 June 2021
          Article
          2106.08191
          f1d5d073-0477-474a-9204-c6c82397c4bd

          http://creativecommons.org/licenses/by/4.0/

          History
          Custom metadata
          23 pages, 18 figures
          physics.ins-det

          Technical & Applied physics
          Technical & Applied physics

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