Improving the FE simulation of molded packages using warpage measurements

Huber, S.; Dijk, M.v.; Walter, H; Wittler, O.; Thomas, T.; Lang, K-D.

doi:10.1016/j.microrel.2014.07.156

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Improving the FE simulation of molded packages using warpage measurements

Author(s): S. Huber , M.v. Dijk , H. Walter , O. Wittler , T. Thomas , K.-D. Lang

Publication date Created: September 2014

Publication date (Print): September 2014

Journal: Microelectronics Reliability

Publisher: Elsevier BV

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Title: Microelectronics Reliability

Abbreviated Title: Microelectronics Reliability

Publisher: Elsevier BV

ISSN (Print): 00262714

Publication date Created: September 2014

Publication date (Print): September 2014

Volume: 54

Issue: 9-10

Pages: 1862-1866

Article

DOI: 10.1016/j.microrel.2014.07.156

SO-VID: f91c38d1-f2df-497d-bba6-ace0182abf64

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https://www.elsevier.com/tdm/userlicense/1.0/

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Improving the FE simulation of molded packages using warpage measurements

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