ScienceOpen:
research and publishing network
For Publishers
Discovery
Metadata
Peer review
Hosting
Publishing
For Researchers
Join
Publish
Review
Collect
My ScienceOpen
Sign in
Register
Dashboard
Blog
About
Search
Advanced search
My ScienceOpen
Sign in
Register
Dashboard
Search
Search
Advanced search
For Publishers
Discovery
Metadata
Peer review
Hosting
Publishing
For Researchers
Join
Publish
Review
Collect
Blog
About
1
views
0
references
Top references
cited by
1
Cite as...
0 reviews
Review
0
comments
Comment
0
recommends
+1
Recommend
0
collections
Add to
0
shares
Share
Twitter
Sina Weibo
Facebook
Email
4,630
similar
All similar
Record
: found
Abstract
: not found
Article
: not found
Improving the FE simulation of molded packages using warpage measurements
Author(s):
S. Huber
,
M.v. Dijk
,
H. Walter
,
O. Wittler
,
T. Thomas
,
K.-D. Lang
Publication date
Created:
September 2014
Publication date
(Print):
September 2014
Journal:
Microelectronics Reliability
Publisher:
Elsevier BV
Read this article at
ScienceOpen
Publisher
Review
Review article
Invite someone to review
Bookmark
Cite as...
There is no author summary for this article yet. Authors can add summaries to their articles on ScienceOpen to make them more accessible to a non-specialist audience.
Related collections
Genome Engineering using CRISPR
Author and article information
Journal
Title:
Microelectronics Reliability
Abbreviated Title:
Microelectronics Reliability
Publisher:
Elsevier BV
ISSN (Print):
00262714
Publication date Created:
September 2014
Publication date (Print):
September 2014
Volume
: 54
Issue
: 9-10
Pages
: 1862-1866
Article
DOI:
10.1016/j.microrel.2014.07.156
SO-VID:
f91c38d1-f2df-497d-bba6-ace0182abf64
Copyright ©
© 2014
License:
https://www.elsevier.com/tdm/userlicense/1.0/
History
Data availability:
Comments
Comment on this article
Sign in to comment
scite_
Similar content
4,630
Effect of foaming processes on the reduction of warpage in glass fiber reinforced plastic composites
Authors:
Soo-hyun Cho
,
Hyun Kim
,
Joo Sohn
…
Influence of mold design and injection parameters on warpage deformation of thin-walled plastic parts
Authors:
Bo Wang
,
Anjiang Cai
Warpage Optimisation Using Recycled Polycar-bonates (PC) on Front Panel Housing
Authors:
Nur Aisyah Miza Ahmad Tamizi
,
Shayfull Zamree Abd Rahim
,
Abdellah Abdellah
…
See all similar
Cited by
1
A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer
Authors:
Seyed Farshchi Yazdi
,
Matteo Garavaglia
,
Aldo Ghisi
…
See all cited by