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      Recent progress in silk fibroin-based flexible electronics

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          Abstract

          With the rapid development of the Internet of Things (IoT) and the emergence of 5G, traditional silicon-based electronics no longer fully meet market demands such as nonplanar application scenarios due to mechanical mismatch. This provides unprecedented opportunities for flexible electronics that bypass the physical rigidity through the introduction of flexible materials. In recent decades, biological materials with outstanding biocompatibility and biodegradability, which are considered some of the most promising candidates for next-generation flexible electronics, have received increasing attention, e.g., silk fibroin, cellulose, pectin, chitosan, and melanin. Among them, silk fibroin presents greater superiorities in biocompatibility and biodegradability, and moreover, it also possesses a variety of attractive properties, such as adjustable water solubility, remarkable optical transmittance, high mechanical robustness, light weight, and ease of processing, which are partially or even completely lacking in other biological materials. Therefore, silk fibroin has been widely used as fundamental components for the construction of biocompatible flexible electronics, particularly for wearable and implantable devices. Furthermore, in recent years, more attention has been paid to the investigation of the functional characteristics of silk fibroin, such as the dielectric properties, piezoelectric properties, strong ability to lose electrons, and sensitivity to environmental variables. Here, this paper not only reviews the preparation technologies for various forms of silk fibroin and the recent progress in the use of silk fibroin as a fundamental material but also focuses on the recent advanced works in which silk fibroin serves as functional components. Additionally, the challenges and future development of silk fibroin-based flexible electronics are summarized.

          (1) This review focuses on silk fibroin serving as active functional components to construct flexible electronics. (2) Recent representative reports on flexible electronic devices that applied silk fibroin as fundamental supporting components are summarized. (3) This review summarizes the current typical silk fibroin-based materials and the corresponding advanced preparation technologies. (4) The current challenges and future development of silk fibroin-based flexible electronic devices are analyzed.

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          Flexible triboelectric generator

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            Triboelectric nanogenerators as new energy technology for self-powered systems and as active mechanical and chemical sensors.

            Zhong Wang (2013)
            Triboelectrification is an effect that is known to each and every one probably since ancient Greek time, but it is usually taken as a negative effect and is avoided in many technologies. We have recently invented a triboelectric nanogenerator (TENG) that is used to convert mechanical energy into electricity by a conjunction of triboelectrification and electrostatic induction. As for this power generation unit, in the inner circuit, a potential is created by the triboelectric effect due to the charge transfer between two thin organic/inorganic films that exhibit opposite tribo-polarity; in the outer circuit, electrons are driven to flow between two electrodes attached on the back sides of the films in order to balance the potential. Since the most useful materials for TENG are organic, it is also named organic nanogenerator, which is the first using organic materials for harvesting mechanical energy. In this paper, we review the fundamentals of the TENG in the three basic operation modes: vertical contact-separation mode, in-plane sliding mode, and single-electrode mode. Ever since the first report of the TENG in January 2012, the output power density of TENG has been improved 5 orders of magnitude within 12 months. The area power density reaches 313 W/m(2), volume density reaches 490 kW/m(3), and a conversion efficiency of ∼60% has been demonstrated. The TENG can be applied to harvest all kinds of mechanical energy that is available but wasted in our daily life, such as human motion, walking, vibration, mechanical triggering, rotating tire, wind, flowing water, and more. Alternatively, TENG can also be used as a self-powered sensor for actively detecting the static and dynamic processes arising from mechanical agitation using the voltage and current output signals of the TENG, respectively, with potential applications for touch pad and smart skin technologies. To enhance the performance of the TENG, besides the vast choices of materials in the triboelectric series, from polymer to metal and to fabric, the morphologies of their surfaces can be modified by physical techniques with the creation of pyramid-, square-, or hemisphere-based micro- or nanopatterns, which are effective for enhancing the contact area and possibly the triboelectrification. The surfaces of the materials can be functionalized chemically using various molecules, nanotubes, nanowires, or nanoparticles, in order to enhance the triboelectric effect. The contact materials can be composites, such as embedding nanoparticles in a polymer matrix, which may change not only the surface electrification but also the permittivity of the materials so that they can be effective for electrostatic induction. Therefore, there are numerous ways to enhance the performance of the TENG from the materials point of view. This gives an excellent opportunity for chemists and materials scientists to do extensive study both in the basic science and in practical applications. We anticipate that a better enhancement of the output power density will be achieved in the next few years. The TENG is possible not only for self-powered portable electronics but also as a new energy technology with potential to contribute to the world energy in the near future.
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              Stretchable silicon nanoribbon electronics for skin prosthesis.

              Sensory receptors in human skin transmit a wealth of tactile and thermal signals from external environments to the brain. Despite advances in our understanding of mechano- and thermosensation, replication of these unique sensory characteristics in artificial skin and prosthetics remains challenging. Recent efforts to develop smart prosthetics, which exploit rigid and/or semi-flexible pressure, strain and temperature sensors, provide promising routes for sensor-laden bionic systems, but with limited stretchability, detection range and spatio-temporal resolution. Here we demonstrate smart prosthetic skin instrumented with ultrathin, single crystalline silicon nanoribbon strain, pressure and temperature sensor arrays as well as associated humidity sensors, electroresistive heaters and stretchable multi-electrode arrays for nerve stimulation. This collection of stretchable sensors and actuators facilitate highly localized mechanical and thermal skin-like perception in response to external stimuli, thus providing unique opportunities for emerging classes of prostheses and peripheral nervous system interface technologies.
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                Author and article information

                Contributors
                zhangxs@uestc.edu.cn
                Journal
                Microsyst Nanoeng
                Microsyst Nanoeng
                Microsystems & Nanoengineering
                Nature Publishing Group UK (London )
                2096-1030
                2055-7434
                6 May 2021
                6 May 2021
                2021
                : 7
                : 35
                Affiliations
                [1 ]GRID grid.54549.39, ISNI 0000 0004 0369 4060, School of Electronic Science and Engineering, , University of Electronic Science and Technology of China, ; Chengdu, 611731 China
                [2 ]GRID grid.26999.3d, ISNI 0000 0001 2151 536X, CIRMM, Institute of Industrial Science, , The University of Tokyo, ; Tokyo, 153-8505 Japan
                [3 ]GRID grid.5333.6, ISNI 0000000121839049, Microsystems Laboratory, École Polytechnique Fédérale de Lausanne (EPFL), ; 1015 Lausanne, Switzerland
                [4 ]GRID grid.11135.37, ISNI 0000 0001 2256 9319, Institute of Microelectronics, , Peking University, ; 100087 Beijing, China
                Author information
                http://orcid.org/0000-0001-9565-299X
                http://orcid.org/0000-0001-9719-0573
                Article
                261
                10.1038/s41378-021-00261-2
                8433308
                34567749
                cf888f10-dd98-434d-a1f0-a0e78a34dfda
                © The Author(s) 2021

                Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

                History
                : 25 December 2020
                : 16 February 2021
                Funding
                Funded by: FundRef https://doi.org/10.13039/501100001809, National Natural Science Foundation of China (National Science Foundation of China);
                Award ID: 62074029, 61804023
                Award ID: 61971108
                Award Recipient :
                Funded by: Fundamental Research Funds for the Central Universities (No. ZYGX2019Z002)
                Categories
                Review Article
                Custom metadata
                © The Author(s) 2021

                electrical and electronic engineering,electronic properties and materials

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